Kimya
ABS-ESD
ABS
Semiconductor assembly trays, electronics manufacturing fixtures; Enclosure
Full specifications
Mechanical
- Tensile strength
- 40 MPa
- Elongation at break
- 12 %
- Flexural strength
- 65 MPa
- Flexural modulus
- 2100 MPa
- Izod impact (notched)
- 13 kJ/m²
- Shore hardness
- 76D
Thermal
- HDT @ 0.45 MPa
- 94 °C
- HDT @ 1.82 MPa
- 84 °C
- Glass transition
- 100 °C
- Max service temp
- 83 °C
Print settings
- Nozzle temp
- 260 °C
- Bed temp
- 100 °C
- Print speed
- 55 mm/s
- Enclosure required
- Yes
- Shrinkage / warping
- 1.05%
- Moisture sensitive
- Yes
Physical
- Density
- 1.06 g/cm³
- Available colors
- Black
- Chemical / UV resistance
- Surface resistivity 10^7 to 10^9 ohms, certified electrostatic discharge protection
